Advancing Autonomous Sensors for Humanoid Robotics to Serve Society
Enhanced ESA Technology
Revolutionary Sensor Integration for Next-Generation Robotics
TuringSpark's breakthrough Enhanced Environmental Sensing Array (ESA) combines multi-modal environmental and tactile perception into a unified intelligent sensor platform, delivering unprecedented capabilities for humanoid robotics applications.
Why Choose TuringSparks?
At TuringSparks, you're not just building a career—you're pioneering the future of human-robot interaction. Work alongside world-class engineers in Taiwan's thriving semiconductor ecosystem, developing breakthrough technologies that will define the next decade of robotics innovation.
From cutting-edge FPGA design to revolutionary AI algorithms, every project pushes the boundaries of what's possible. Join us in creating intelligent sensors that don't just sense—they understand, learn, and adapt.
Why Our Team Loves Working Here
Cutting-Edge Technology
Work with the latest FPGA, AI, and sensor fusion technologies in an innovation-driven environment.
High-Impact Projects
Every project shapes the future of humanoid robotics and human-AI collaboration.
Growth Opportunities
Accelerated career development in one of the fastest-growing technology sectors.
Collaborative Culture
Work with diverse, world-class talent in a supportive, innovation-focused environment.
Industry Leadership
Be part of Taiwan's semiconductor excellence and global technology leadership.
Innovation Freedom
Autonomy to explore breakthrough ideas and shape next-generation product development.
Open Positions
Senior FPGA Design Engineer
Hardware Engineering
Lead the design and optimization of our revolutionary three-chip sensor architecture, working with cutting-edge FPGA and ASIC technologies.
Key Requirements:
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5+ years FPGA/ASIC design experience
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Verilog/SystemVerilog expertise
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Experience with ZYNQ platforms
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Knowledge of sensor interface design
AI Algorithm Engineer
Artificial Intelligence
Develop breakthrough edge AI algorithms for real-time sensor fusion and autonomous learning in humanoid robotics applications.
Key Requirements:
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MS/PhD in AI, ML, or related field
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Edge AI and embedded systems experience
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TensorFlow Lite, neural network optimization
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Real-time processing expertise
MEMS Sensor Integration Specialist
Hardware Engineering
Drive integration of multi-modal MEMS sensors with our intelligent processing architecture for next-generation tactile perception.
Key Requirements:
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Background in MEMS sensor technology
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IMU, force, temperature sensor expertise
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Signal processing and calibration
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Experience with sensor fusion algorithms
Robotics Application Engineer
Applications
Work directly with leading robotics companies to integrate our intelligent sensors into next-generation humanoid platforms.
Key Requirements:
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Robotics engineering background
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ROS, control systems experience
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Customer-facing technical role experience
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Understanding of humanoid robotics
Packaging Technology Engineer
Manufacturing
Lead development of our breakthrough FOPLP packaging technology for high-density sensor integration in robotic applications.
Key Requirements:
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Semiconductor packaging experience
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FOPLP, SiP technology background
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Knowledge of Taiwan manufacturing ecosystem
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Process optimization expertise
Business Development Manager
Business Development
Build strategic partnerships with leading robotics companies and expand TuringSpark's presence in global humanoid robotics markets.
Key Requirements:
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5+ years B2B technology sales
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Robotics or semiconductor industry experience
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Strong technical communication skills
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Global market development experience